Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...

Engineered-diamond thermal platform designed for integration into advanced packaging workflows and heterogeneous systems Diamond Quanta today announced Adamantine Thermal™, an engineered-diamond ...

The semiconductor industry is undergoing a profound shift in packaging technologies to ones that rely on close collaboration among multiple stakeholders to solve intricate, multi-faceted, and ...

The chip industry is ratcheting up investments in advanced packaging as it strives to keep pace with demands for increased functionality and higher performance, including novel patterning technologies ...

Breakthrough yield and device performance at high volume show team can scale company’s large-format advanced packaging for customers’ cutting-edge applications SINGAPORE, SG / ACCESS Newswire / ...

In today's fast-changing technological landscape, two key theories determine the future of semiconductor design: Moore's Law and the More-than-Moore approach. While Moore's Law focuses on increasing ...

HANOI, Vietnam, Jan. 29, 2026 /PRNewswire/ --On January 28, 2026, in Hanoi, FPT Corporation officially announced the establishment of the FPT Advanced Semiconductor Testing and Packaging Plant, aiming ...

Artificial intelligence (AI) is reshaping the semiconductor landscape-both as a fast-growing end market and as a catalyst for innovation across mobile, automotive, networking, industrial and beyond.

Nova achieved record revenue of $672.4 million for 2024, representing a 30% year-over-year increase, and non-GAAP net income grew 38%. President and CEO Gaby Waisman highlighted strong product ...