Si2, IEEE, and IEEE EDS are sponsoring the second edition of the International Compact Modeling Conference (ICMC). Paper ...
Artificial intelligence/Machine Learning-driven modeling reduces time-to-market for faster Design Technology Co-Optimization development and accelerates model parameter extraction for advanced nodes, ...
A device modeling product, BSIMPro+, and a new version of RFPro for RF device modeling improve the accuracy of device models for very deep-submicron (0.13 µm and below) silicon processes, especially ...
A new technical paper titled “A Comprehensive Technique Based on Machine Learning for Device and Circuit Modeling of Gate-All-Around Nanosheet Transistors” was published by researchers at National ...
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