Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.

TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703), in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has successfully achieved three-dimensional (3D) ...

Researchers from Penn State have demonstrated a novel method of 3D integration using 2D materials. This advancement, detailed in their recent study, addresses the growing challenge of fitting more ...

Purdue faculty dedicate countless hours to exploring the frontiers of their respective fields, pushing the boundaries of knowledge and contributing to the ever-evolving landscape of academia. To ...

It has taken decades of research and development and strong commitment to various industry programs, but the stars are finally aligning for 3D semiconductor systems. No one could have left the 3D & ...

SUNNYVALE, Calif. & AMERICAN FORK, Utah--(BUSINESS WIRE)--Quanergy Systems, Inc., (NYSE: QNGY) a leading provider of LiDAR sensors and smart 3D solutions, today announced a technology integration with ...

A technology for the three-dimensional integration of processing units and memory, as reported by researchers from Tokyo Tech, has achieved the highest attainable performance in the whole world, ...

BOSTON and LOS ANGELES, April 13, 2021 — PTC is proud to announce that its industry-leading FlexPLM platform will integrate with VNTANA to empower retail, apparel, footwear and accessories companies ...

In recent years, 3D printing has enjoyed a high media profile. The process actually refers to a raft of technologies that operate according to different physical and chemical principles and ...

Contributing editor Françoise Von Trap writes about 3D technology and packaging in Electronic Design's 2010 Forecast issue and highlights some of the research going on with TSV (through-silicon via) ...