Preventing plating and soldering voids is about testing new manufacturing processes and analyzing the results. Plating and soldering voids usually have an identifiable cause, such as the type of ...
Today’s electronic packages have high clock speeds (multi-gigahertz range), fine pin densities (below 0.4-mm pitch), and high pin counts (over 2000). When assembled onto a printed-circuit board (PCB), ...
What methods can be applied to verify PCB functionality and safety? Which are suitable for mass production and for prototypes? What parameters are checked in each test? How to check a PCB without ...
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