The federal award enables the High Density Electronics Center to upgrade its equipment and capabilities while conferring status as a Power Packaging Center of Excellence.

Hitachi Energy, a global leader in electrification, and Pakal Technologies, a cutting-edge innovator in silicon power semiconductor design, announced a collaboration to advance shared value creation ...

The University of Arkansas has received a $3.5 million grant to upgrade its High-Density Electronics Center and become a Power Packaging ...

Note: This course requires purchase of a parts kit in order to complete assignments. The kit will be used from the first experiment in the 2nd week of class and throughout the course and the following ...

Dublin, Jan. 21, 2026 (GLOBE NEWSWIRE) -- The "Power Module Packaging - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2026-2031)" has been added to ResearchAndMarkets.com's ...

As global energy demand surges—driven by AI-hungry data centers, advanced manufacturing, and electrified transportation—researchers at the National Renewable Energy Laboratory have unveiled a ...

Modern-day graphics processing units (GPUs) and other AI chips are massive. The unfortunate tradeoff is that they also consume an enormous amount of power, and their power needs are rising ...

TDK said the DC-DC converter is already used in Altera’s Agilex family of FPGAs and AMD’s programmable SoCs, including ...

Anna Wood, Editor at Electronic Specifier, picks her top 5 IoT products released in February 2026. Authorised distributor ...