The federal award enables the High Density Electronics Center to upgrade its equipment and capabilities while conferring status as a Power Packaging Center of Excellence.
The University of Arkansas has received a $3.5 million grant to upgrade its High-Density Electronics Center and become a Power Packaging ...
As efforts to protect the environment have advanced, the use of inverters in industrial applications and green energy systems have continued to grow rapidly as a way to achieve low-power motor control ...
Enables automotive OEMs and power converter designers to accelerate the time to market for discrete devices and power modules SANTA ROSA, Calif.--(BUSINESS WIRE)--Keysight Technologies, Inc. (NYSE: ...
CHANDLER, Ariz., Feb. 03, 2026 (GLOBE NEWSWIRE) -- The increasing AI and high-performance computing workloads demand power solutions that combine efficiency, reliability and scalability. Integrated ...
Developing a power module requires enhanced design and verification methods. Currently, multiple iterations are needed to get the design done. Today, design and manufacturing processes are heavily ...
TOKYO--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it will invest approximately 10 billion yen to construct a new facility for the assembly and inspection of ...
You’re undoubtedly familiar with power-switching devices such as the venerable and still very viable insulated-gate bipolar transistor (IGBT). An enhanced variation is the B-TRAN bipolar junction ...
The MSK3004 is an H-bridge MOSFET power module available in a space efficient isolated ceramic tab power SIP package. This device contains P-channel MOSFETS for the top transistors and N-channel ...
(Image courtesy of Elsevier Publishing). Who else would you want to author a book about the IGBT (insulated gate bipolar transistor) than its inventor, Dr. B. Jayant Baliga? This invention is widely ...
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