Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).

Dublin, Jan. 21, 2026 (GLOBE NEWSWIRE) -- The "Power Module Packaging - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2026-2031)" has been added to ResearchAndMarkets.com's ...

In an exclusive interview with TI’s director of power management R&D, we explore the role of advanced packaging in low-voltage power electronics. From state-of-the-art materials and process technology ...

The University of Arkansas has received a $3.5 million grant to upgrade its High-Density Electronics Center and become a Power Packaging ...

These ultra-tiny power modules developed by Texas Instruments, which are 23% smaller than competing devices, also improve power density and efficiency. 1. New power modules built with MagPack ...

The federal award enables the High Density Electronics Center to upgrade its equipment and capabilities while conferring status as a Power Packaging Center of Excellence.

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...

(MENAFN- GlobeNewsWire - Nasdaq) The market presents opportunities in EV traction inverters with the rise of SiC & GaN devices, industrial motor drive energy efficiency, and regional diversification ...