The "Automotive-Grade Power Semiconductor and Module (SiC, GaN) Industry Research Report, 2025" has been added to ResearchAndMarkets.com's offering. SiC/GaN research indicates a significant uptick in ...
Dublin, Jan. 21, 2026 (GLOBE NEWSWIRE) -- The "Power Module Packaging - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2026-2031)" has been added to ResearchAndMarkets.com's ...
A stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by one-fold, SiC power modules allow for ...
(MENAFN- GlobeNewsWire - Nasdaq) Key market opportunities exist in the rapid growth and deployment of advanced SiC and GaN power devices within new energy vehicles, driven by increasing sales of 800V+ ...
Vancouver, Oct. 10, 2023 (GLOBE NEWSWIRE) -- The global Power Module Packaging Market size was USD 1.84 billion in 2022 and is expected to register a steady revenue CAGR of 9.7 % during the forecast ...
TOKYO--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO: 6503) announced today the coming release of six new J3-Series power semiconductor modules for various electric vehicles (xEVs), ...
onsemi’s EliteSiC silicon carbide (SiC) modules increase the efficiency and lower the weight of the South Korean automaker’s traction inverters, extending electric vehicle (EV) range and improving ...
(MENAFN- GlobeNewsWire - Nasdaq) The market presents opportunities in EV traction inverters with the rise of SiC & GaN devices, industrial motor drive energy efficiency, and regional diversification ...
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