Market Outlook, Supply Chain Risk & Technology Trends 2026-2036" explores the growing power module packaging materials market, driven by the rise of SiC and GaN semiconductors and electric vehicles.

ROHM Semiconductor today announced it has begun online sales of new SiC molded modules: TRCDRIVE pack™, HSDIP20 and DOT-247. Amid growing concerns over tightening global power supply and the ...

The "Automotive-Grade Power Semiconductor and Module (SiC, GaN) Industry Research Report, 2025" has been added to ResearchAndMarkets.com's offering. SiC/GaN research indicates a significant uptick in ...

A stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by one-fold, SiC power modules allow for ...

Dublin, Jan. 21, 2026 (GLOBE NEWSWIRE) -- The "Power Module Packaging - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2026-2031)" has been added to ResearchAndMarkets.com's ...

(MENAFN- GlobeNewsWire - Nasdaq) Key market opportunities exist in the rapid growth and deployment of advanced SiC and GaN power devices within new energy vehicles, driven by increasing sales of 800V+ ...

TOKYO--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO: 6503) announced today the coming release of six new J3-Series power semiconductor modules for various electric vehicles (xEVs), ...

onsemi’s EliteSiC silicon carbide (SiC) modules increase the efficiency and lower the weight of the South Korean automaker’s traction inverters, extending electric vehicle (EV) range and improving ...

(MENAFN- GlobeNewsWire - Nasdaq) The market presents opportunities in EV traction inverters with the rise of SiC & GaN devices, industrial motor drive energy efficiency, and regional diversification ...