With complexity of sub-90nm SOCs driving the need for test to be integrated throughout the design process, both of EDA’s largest vendors today introduced major upgrades to their respective offerings.

Because electronic systems for all applications in end-user markets must provide the highest possible reliability to match customers’ quality expectations, semiconductor components undergo multiple ...

The first generation of serial standard applications is already well established, and the move to the second and third generation is underway, says Randy White, high-speed serial-applications ...

The variety of different test methodologies combined with today�s mixture of memory devices creates a complex test profile. The manufacturing test floor hums with activity; a range of memory devices ...

Passive Entry Passive Start (PEPS) technology has become standard in the automotive market for keyless operation. A secure wireless communication system, PEPS enables you to lock and unlock the ...

Among the first decisions to be made when initiating a composites testing program is the selection of test methods to follow. Unless performing highly customized testing, it’s usually not difficult to ...

TOKYO, Sept. 23, 2020 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) has announced its next-generation V93000 testers targeted at advanced digital ...

This chapter discusses helmet ballistic testing methodologies. It describes helmet design and suspension systems as well as current and proposed clay head forms used in the ballistic testing of ...

When asked, many engineers will say that the goal of a test plan for a PCB is full or 100% test coverage. When pressed further, they usually admit that 100% test coverage is virtually impossible to ...

A variety of threats lead to head injuries in the battlefield. Since World War II (WWII), the predominant threats have been: fragmentation and ballistic threats from explosions, artillery, and small ...