Last year, Semtech released the LR2021 LoRa Plus transceiver chip, designed to address the low data-rate issue associated with LoRa, but surprisingly, ...
Abstract: This paper presents the design, simulation, analysis and characterization of a heterogenous 3D integration approach for miniaturization of RF front-end modules. The 3D integrated stack ...
Abstract: Silicon interposers are providing interesting alternatives to organic packages for the fabrication of complex system in package (SIP) modules in particular for RF application. Among the ...
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