Abstract: Advanced packaging solutions for wide bandgap power devices, such as silicon carbide (SiC) MOSFETs, can help realize their full potential. Additively printed electronics present a promising ...
Abstract: This letter proposes a unified concept of the active impedance module and its control method with minimum power processing. The impedance value and type of the proposed active impedance ...
General Motors has released a new customer satisfaction program (CSP) for certain units of the Chevy Equinox EV and Chevy Blazer EV, addressing a potential issue with the all-electric crossovers’ ...
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