Package provides necessary electrical interconnections, mechanical support, environmental protection and thermal structure for semiconductor chips. Package can be divided into ceramic package, metal ...
Abstract: Monocular depth estimation is a critical task with significant potential for real-time applications. However, current networks for monocular depth estimation exhibit a trade-off between ...
Background: Vestibular migraine (VM) is the most common cause of episodic vertigo, yet its diagnostic markers remain limited. Perception of verticality, measured via static subjective visual vertical ...
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