Automated DIC imaging with the DM6 M microscope enhances six-inch wafer inspection, providing reproducible results and improved efficiency for defect analysis.
Failure analysis typically begins with identifying a region of interest (ROI) on a sample for detailed examination using tools such as a Scanning Electron Microscope (SEM), Focused Ion Beam (FIB), or ...
Some industry sectors such as automotive and medical continue to push for higher and higher reliability levels; however, many fabs are having difficulties achieving them. Current inspection regimes ...
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