Abstract: To address the issues of voids and insufficient interface fusion commonly encountered in electroless copper plating interconnections for high-density packaging, this paper proposes a ...
Study on the Electrothermal Properties of Cu-CNT TSV Interconnects Under Multiphysics Field Coupling
Abstract: In order to improve the electrical transmission and heat dissipation performance of through-silicon vias (TSVs) in high-frequency, high-density, and highly integrated environments, the ...
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