Abstract: In this study, we present a low interconnection loss antenna-in-package (AiP) using a chip-embedded metal fan-out wafer-level package (mFOWLP) technology for D-band (110–170 GHz) ...

Abstract: As the development speed of Moore's Law slows down, advanced packaging has emerged as a pivotal approach to enhancing chip performance, yet the accompanying thermal management challenges ...

One of the things I need to do when I’m about to go out of the office is to set up my automatic replies in Microsoft Outlook. It’s usually the last thing I do before I sign off and it can be really ...

Whenever In-N-Out opens in a new state, it’s a big deal. So big, in fact, the massive lines become their own news story. When the cult-favorite fast food chain opened in Idaho two years ago, customers ...

Deeply disturbing photos of an upstate classroom’s wooden “time-out’’ box with bare walls and a padded floor surfaced on social media last week, sparking a firestorm of outrage. The ominous-looking ...